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P8H61/USB3 R2.0
H61 with up to 170% faster USB 3.0
speeds and optimized network
bandwidth
• DIGI+ VRM - Digital Power Design for the CPU
• USB 3.0 Boost - Faster USB 3.0 Transmission with UASP mode
• Network iControl - Real-time Network Bandwidth Control
• AI Suite II - One-stop Access to Innovative ASUS Features
• Anti Surge - Full-time Power Guardian-Make System Free From Risk
• Windows 8 Ready – Assured Compatibility
LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 /
Core™ i5 / Core™ i3 / Pentium® / Celeron® Processors
This motherboard supports the Intel® 3rd/2nd generation
Core™ i7/i5/i3/Pentium®/Celeron® processors in the LGA1155
package, with iGPU, memory, and PCI Express controllers
integrated to support onboard graphics out with dedicated
chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI
Express 3.0/2.0 lanes. This provides great graphics performance. Intel® 3rd/2nd
generation Core™ i7/i5/i3/Pentium®/Celeron® processors are among the most
powerful and energy efficient CPUs in the world.
Intel® H61 Express Chipset
The Intel® H61 Express Chipset is a single-chipset design
to support the new 1155 socket Intel® 3rd/2nd Generation
Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron®
processors. It provides improved performance by utilizing
serial point-to-point links, which allows increased bandwidth
and stability.
PCIe 3.0 Ready
PCI Express® 3.0 (PCIe 3.0) is the latest PCI Express
bus standard with improved encoding schemes that
provide twice the performance of current PCIe 2.0.
Total bandwidth for a x16 link reaches a maximum of
32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0
provides users unprecedented data speeds, combined with the convenience
and seamless transition offered by complete backward compatibility with PCIe
1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users
who wish to improve and optimize graphic performance, as well as have the
latest technology available to them.
*PCIe 3.0 speed is supported by Intel® 3rd generation Core™ processors.
Dual-Channel DDR3 2200(O.C) / 2133(O.C) / 2000(O.C) / 1866
(O.C) / 1600 / 1066 / 1333 support
The motherboard supports DDR3 memory that features data transfer rates of
2200(O.C )/2133(O.C )/2000(O.C )/1866(O.C )/1600/1066/1333 suppor MHz to
meet the higher bandwidth requirements of the latest 3D graphics, multimedia,
and Internet applications. The dual-channel DDR3 architecture enlarges the
bandwidth of your system memory to boost system performance.
• DDR3 1600 MHz and higher memory frequency is supported by Intel® 3rd
generation processors.
• Due to the CPU behavior, DDR3 2133/1866 memory module will run at DDR3
2000/1800 MHz frequency
•
CPU, Chipset and Graphics Features
USB 3.0 Support
Experience ultra-fast data transfer at 4.8Gbps with USB 3.0 – the latest connectivity standard. Built to connect easily with next-generation
components and peripherals, USB 3.0 transfers data 10x faster and is also backward compatible with USB 2.0 components.
Intel® Smart Connect Technology, Intel® Rapid Start Technology
Intel® Smart Connect Technology:
Auto Application Refresh. Less Waiting Time. Your computer can receive web updates with fresh content for selected applications, even when the system is in
sleep mode. This means less time waiting for applications to update and sync with the cloud, leading to a more efficient computing experience.
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